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5.0 mm
DIA LED
LAMP
REV:A / 0
560PR2C
PACKAGE DIMENSIONS
Note: 1.All Dimensions are in millimeters. 2.Tolerance is 0.25mm(0.010 ") Unless otherwise specified. 3.Protruded resin under flange is 1.5mm(0.059 ") max. 4.Lead spacing is measured where the leads emerge from the package. 5.Specification are subject to change without notice
DRAWING NO. : DS-35-04-0744
DATE : 2004-12-03
Page : 1
HD-R/RD013
5.0 mm
DIA LED
LAMP
REV:A / 0
560PR2C
FEATURES * 5.0mm DIA LED LAMP * HIGH LUMINOUS INTENSITY OUTPUT. * LOW POWER CONSUMPTION. * HIGH EFFICIENCY. * VERSATILE MOUNTING ON P.C. BOARD OR PANEL. * I.C. COMPATIBLE. CHIP MATERIALS * Dice Material : GaAlInP/GaAs * Light Color : SUPER RED * Lens Color : WATER CLEAR ABSOLUTE MAXIMUM RATING : ( Ta = 25C )
SYMBOL PAD VR IAF IPF Topr Tstg PARAMETER Power Dissipation Per Chip Reverse Voltage Per Chip Continuous Forward Current Per Chip Peak Forward Current Per Chip (Duty0.1,1KHz) Derating Linear From 25C Per Chip Operating Temperature Range Storage Temperature Range
ULTRA ORANGE 80 5 30 120 0.40
UNIT mW V mA mA mA/C
-25C to 85C -40C to 85C
Lead Soldering Temperature1.6mm(0.063 inch) From Body260C 5C for 5 Seconds
ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25C )
SYMBOL VF IR D 21/2 IV PARAMETER Forward Voltage Reverse Current Dominant Wavelength Spectral Line Half-Width Half Intensity Angle Luminous Intensity TEST CONDITION MIN. IF = 20mA VR = 5V IF = 20mA IF = 20mA IF = 20mA IF = 20mA 50 620 624 20 55 60 4000 2600 3200 1.8 TYP. 2.1 MAX. UNIT 2.6 100 630 V A nm nm deg mcd
DRAWING NO. : DS-35-04-0744
DATE : 2004-12-03
Page : 2
HD-R/RD014
5.0 mm
DIA LED
LAMP
REV:A / 0
560PR2C
DRAWING NO. : DS-35-04-0744
DATE : 2004-12-03
Page : 3
5.0 mm
SOLDERING
METHOD
DIA LED
LAMP
REV:A / 0
560PR2C
SOLDERING CONDITIONS REMARK
DIP SOLDERING
Bath temperature: 2605 Immersion time: with 5 sec
Solder no closer than 3mm from the base of the package Using soldering flux," RESIN FLUX" is recommended.
During soldering, take care not to press the tip of iron against the Soldering iron: 30W or smaller lead. SOLDERING Temperature at tip of iron: 260 or lower (To prevent heat from being IRON Soldering time: within 5 sec. transferred directly to the lead, hold the lead with a pair of tweezers while soldering 1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1), be careful not to stress the leads with iron tip.
Lead wries
Panel
(Fig.1)
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
Lead wries
Leave
a slight clearance
(Fig.2)
DRAWING NO. : DS-35-04-0744
DATE : 2004-12-03
Page : 4
5.0 mm
DIA LED 560PR2C
LAMP
REV:A / 0
3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to avoid steering the leads (See Fig.3).
PC board
F ig.3 jig
4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature.
LED MOUNTING METHOD
1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective components including the LED should be taken into account especially when designing the case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the shape of the holes should be made oval. (See Fig.4)
case
pc board
Fig.4
DRAWING NO. : DS-35-04-0744
DATE : 2004-12-03
Page : 5
5.0 mm
DIA LED 560PR2C
LAMP
REV:A / 0
2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs.
Tube
Stand-off
Fig.5
Fig.6
FORMED LEAD
1) The lead should be bent at a point located at least 2mm away from the package. Bending should be performed with base fixed means of a jig or pliers (Fig.7)
Fig.7
2) Forming lead should be carried our prior to soldering and never during or after soldering. 3) Form the lead to ensure alignment between the leads and the hole on board, so that stress against the LED is prevented. (Fig.8)
DRAWING NO. : DS-35-04-0744
2mm
DATE : 2004-12-03
Page : 6
5.0 mm
LEAD STRENGTH
1) Bend strength Do not bend the lead more than twice. (Fig.9)
DIA LED 560PR2C
LAMP
REV:A / 0
Fig.9
2) Tensile strength (@Room Temperature) If the force is 1kg or less, there will be no problem. (Fig.10)
OK
1Kg
Fig.10
HANDLING PRECAUTIONS
Although rigid against vibration, the LEDs may damaged or scratched if dropped. So take care when handling.
CHEMICAL RESISTANCE
1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration. 2) When washing is required, refer to the following table for the proper chemical to be sued. (Immersion time: within 3 minutes at room temperature.) SOLVENT Freon TE Chlorothene Isopropyl Alcohol Thinner Acetone Trichloroethylene --Usable ADAPTABILITY NOTE: Influences of ultrasonic cleaning of the LED resin body differ depending on such factors as the oscillator output, size of the PC board and the way in which the LED is mounted. Therefore, ultrasonic cleaning should only be performed after confirming there is no problem by conducting a test under practical.
--Do not use.
DRAWING NO. : DS-35-04-0744
DATE : 2004-12-03
Page : 7
5.0 mm
DIA LED 560PR2C
LAMP ssREV:A / 0
Experiment Item:
Item Test Condition
Lamp & IR Ta 255 IF= 20mA RH=60%RH DYNAMIC:100mA 1ms 1/10 duty STATIC STATE: IF20mA TEST TIME: 168HRS-24HRS+24HRS 500HRS-24HRS+24HRS 1000HRS-24HRS+72HRS Ta 655 RH 9095%RH TEST TIME240HRS2HRS 10525-5525 30min 5min 30min 5min 10CYCLES 1055-555 10min 10min 10CYCLES Reference Standard
OPERATION LIFE
MIL-STD-7501026 MIL-STD-8831005 JIS C 7021B-1
HIGH TEMPERATURE HIGH HUMIDITY STORAGE TEMPERATURE CYCLING
MIL-STD-202103B JIS C 7021 B-1
MIL-STD-202107D MIL-STD-7501051 MIL-STD-8831010 JIS C 7021 A-4 MIL-STD-202107D MIL-STD-7501051 MIL-SYD-8831011 MIL-STD-202210A MIL-STD-750-2031 JIS C 7021A-1 MIL-STD-202208D MIL-STD-7502026 MIL-STD-8832003 JIS C 7021 A-2
THERMAL SHOCK
SOLDER RESISTANCE
Tsol2605 DWELL TIME10lsec Tsol2305 DWELL TIME5lsec
SOLDERABILITY
DRAWING NO. : DS-35-04-0744
DATE : 2004-12-03
Page : 8

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